한국플렉시블일렉트로닉스산업협회는
회원사의 다양한 참여와 연계를 지원합니다.
담당자 | KoPEA | 등록일 | 2013-12-09 |
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첨부파일 |
<ESTC 2014>5th Electronics System-Integration Technology Conference September 16 – 18, 2014 Finlandia Hall, Helsinki, Finland TopicsESTC is covering the following topics: 3D Integration and Embedding Technologies Challenges and solutions in 3D integration, embedded structures, wafer level packaging, micro-bonding, TSVs, TEVs, advanced substrates and interposers Advanced Technologies for Emerging Systems Allotropes of carbon (CNTs, graphene, DLC, etc.), nanopackaging (nanoscaled materials, nanowires, nanointerconnects), emerging packaging concepts and technologies for bio-electronics, microfluidics, wearable electronics and sensors/actuators Assembly and Manufacturing Technologies Novel Assembly technologies, manufacturing aspects to novel packaging, wafer level processing Materials for Interconnects and Packaging New materials and processing - e.g. phase change, self-organizing, piezoelectric, dielectric and memory materials, nanomaterials, advanced interconnection metallurgies, adhesives in advanced interconnects MEMS/NEMS Packaging Challenges and solutions in processing, integration and packaging, new packaging approaches, TSVs in MEMS, bonding technologies, wafer bonding, micro-bonding Co-design and Multiphysics System Modeling Thermal, mechanical and electrical modeling and experimental verifications, signal and power integrity Optoelectronic Systems Packaging Fiber optical interconnects, optical sensors, LEDs and other photonic devices, optical chip-scale and heterogeneous integration, lasers Power Electronic Systems Packaging High performance packaging (low RDS(on), low Rth, high temperature), power embedding, very high voltage (>6.5kV) solutions, wide bandgap power seiconductor devices (e.g. SiC, GaN, GaAs), novel cooling solutions (e.g. double-sided cooling, bond-wire-less Printable Electronics Printed/jetted (transparent) conductors, touch and large area sensors, signage and displays (e.g. OLED, electrochrome, electrophoretic, paper electronics, printed thin film PV and photodetectors, 3D printing Reliability of Electronic Devices and Systems New results at different levels of system integration (chip contacts, packages, assemblies and subsystems), characterization and test, failure diagnostic, methodical and equipment developments, upcoming challenges due to new system integration demands, innovative materials and extended application fields |