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인쇄전자산업 소식

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ESTC 2014안내

인쇄전자산업 소식
담당자 KoPEA등록일2013-12-09
첨부파일
인쇄전자산업 소식
<ESTC 2014>

5th Electronics System-Integration Technology Conference

September 16 – 18, 2014

Finlandia Hall, Helsinki, Finland

Topics

ESTC is covering the following topics:

3D Integration and Embedding Technologies

Challenges and solutions in 3D integration, embedded structures, wafer level packaging, micro-bonding, TSVs, TEVs, advanced substrates and interposers

Advanced Technologies for Emerging Systems

Allotropes of carbon (CNTs, graphene, DLC, etc.), nanopackaging (nanoscaled materials, nanowires, nanointerconnects), emerging packaging concepts and technologies for bio-electronics, microfluidics, wearable electronics and sensors/actuators

Assembly and Manufacturing Technologies

Novel Assembly technologies, manufacturing aspects to novel packaging, wafer level processing

Materials for Interconnects and Packaging

New materials and processing - e.g. phase change, self-organizing, piezoelectric, dielectric and memory materials, nanomaterials, advanced interconnection metallurgies, adhesives in advanced interconnects

MEMS/NEMS Packaging

Challenges and solutions in processing, integration and packaging, new packaging approaches, TSVs in MEMS, bonding technologies, wafer bonding, micro-bonding

Co-design and Multiphysics System Modeling

Thermal, mechanical and electrical modeling and experimental verifications, signal and power integrity

Optoelectronic Systems Packaging

Fiber optical interconnects, optical sensors, LEDs and other photonic devices, optical chip-scale and heterogeneous integration, lasers

Power Electronic Systems Packaging

High performance packaging (low RDS(on), low Rth, high temperature), power embedding, very high voltage (>6.5kV) solutions, wide bandgap power seiconductor devices (e.g. SiC, GaN, GaAs), novel cooling solutions (e.g. double-sided cooling, bond-wire-less

Printable Electronics

Printed/jetted (transparent) conductors, touch and large area sensors, signage and displays (e.g. OLED, electrochrome, electrophoretic, paper electronics, printed thin film PV and photodetectors, 3D printing

Reliability of Electronic Devices and Systems

New results at different levels of system integration (chip contacts, packages, assemblies and subsystems), characterization and test, failure diagnostic, methodical and equipment developments, upcoming challenges due to new system integration demands, innovative materials and extended application fields

홈페이지 : http://www.estc2014.eu


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